What's your application - Silicon wafers


Wafer dicing to singulate die such as processors, chips, other etched devices etc.

Process Targets

Process and blade optimisation to ensure the highest productivity and lowest cost without sacrificing cut quality, optimisation of work holding materials & chucks to minimise top and bottom surface chipping, protection of special coatings or fine MEMS structures, maintaining accurate cutting tolerances to keep within the streets.


There are two options for you to pursue wafer dicing. Firstly, Loadpoint manufacture a number of machine systems so you can perform the work at your premise. Secondly, Loadpoint offer a sub-contract dicing and processing service whereby you send us your material and specifications and we will dice and return the work for you.


MicroAce 66: 6” / 155mm dia. x 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 200: 8” / 200mm dia. X 13mm work area, 2”, 3” and 4” blade capacity

NanoAce 300: 12” / 300mm dia. x 13mm work area, 2” and 3” blade capacity

NanoAce 450: 18” x12” / 450x300mm x 10mm work area, 2” and 3” blade capacity

For post-dice cleaning: Washpoint

For preparation of tape rings / hoop rings: Presspoint

Loadpoint Production

Loadpoint’s production facility for dicing, cutting, drilling, grinding & prototyping

Click on the following links for information on our in-house production capabilities for wafer and substrate dicing and processing:

Wafer and substrate dicing

Wafer reduction / edge trimming